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- Lenton 1800¡É chamber furnace with 1200¡É gas purification and computer control system
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- Atmosphere gas : H2, Ar, N2, NH3, O2, CO, CO2, etc.
- Vacuum system : 1×10
-5×10 Torr
- H2/N2, Automatic control system
- MFC & Readout controller
- Temperature : 1200, 1400, 1500, 1600, 1700, 1800 °C
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¿ë µµ
- Oxidation Furnace
- Diffusion Furnace
- Annealing Furnace
- Sintering Furnace
- Bonding Furnace
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Ư ¼º
- Atmosphere Gas : N2, O2, Ar, H2 etc.
- 3-zone, 1-zone Tube
Furnaces
- Wafer 4, 6, 8 inch
¶Ç´Â ±âŸ size (cutting, mm)
- Quartz tube, carrier,
carrier boat, push pull rod
- Temperature range
: 100~1500 °C
- Type : Horizontal
or Vertical
- Ź¿ùÇÑ ¿Âµµ ¾ÈÁ¤µµ¿Í
Á¤¹Ðµµ Á¦°ø.
- Loading : Manual,
Auto System
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¼¿ï´ëÇб³
½Å¼ÒÀ翬±¸¼Ò
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1600(°C) PTF-16/75/450
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3"
Wafer Annealing
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Æ÷Ç×
»ê¾÷°úÇבּ¸¿ø
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1100(°C) PTF-11/290/120
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8"
Wafer Oxidation
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»ï¼ºÀüÀÚ
(ÁÖ) ¿¬±¸¼Ò
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1200(°C) PTF-12/150/900
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4"
Wafer Annealing
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±¤ÁÖ °úÇбâ¼ú¿ø
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1500(°C) LTF-15/150/450
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4"
Wafer Sintering
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»ï¼ºÀüÀÚ
(ÁÖ) ¿¬±¸¼Ò
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1500(°C) PTF-15/200/900
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6"
Wafer Sintering
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¼º±Õ°ü´ëÇб³
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1200(°C) GTF-12/90/364
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Wafer
Oxidation
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¿µ³²´ëÇб³
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1200(°C) GZF-12/70/728
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Wafer
Diffusion
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Æ÷Ç×°ø°ú´ëÇб³
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1200(°C) GTF-12/170/728
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4"
Wafer Bonding
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»ï¼ºÁ¾ÇÕ±â¼ú¿ø
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1200(°C) GTF-12/170/728
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Annealing
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Àü³²´ëÇб³
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1200(°C) GTF-12/170/728
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Annealing
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¼º±Õ°ü´ëÇб³
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1200(°C) GTF-12/50/546
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Wafer
N2/Vacuum (10-3)
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