• Lenton 1800¡É chamber furnace with 1200¡É gas purification and computer control system


 



  • Atmosphere gas : H2, Ar, N2, NH3, O2, CO, CO2, etc.
  • Vacuum system : 1×10-5×10 Torr
  • H2/N2, Automatic control system
  • MFC & Readout controller
  • Temperature : 1200, 1400, 1500, 1600, 1700, 1800 °C



 



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  • Oxidation Furnace
  • Diffusion Furnace
  • Annealing Furnace
  • Sintering Furnace
  • Bonding Furnace

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  • Atmosphere Gas : N2, O2, Ar, H2 etc.
  • 3-zone, 1-zone Tube Furnaces
  • Wafer 4, 6, 8 inch ¶Ç´Â ±âŸ size (cutting, mm)
  • Quartz tube, carrier, carrier boat, push pull rod
  • Temperature range : 100~1500 °C
  • Type : Horizontal or Vertical
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  • Loading : Manual, Auto System


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1600(°C) PTF-16/75/450

3" Wafer Annealing

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1100(°C) PTF-11/290/120

8" Wafer Oxidation

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1200(°C) PTF-12/150/900

4" Wafer Annealing

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1500(°C) LTF-15/150/450

4" Wafer Sintering

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1500(°C) PTF-15/200/900

6" Wafer Sintering

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1200(°C) GTF-12/90/364

Wafer Oxidation

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1200(°C) GZF-12/70/728

Wafer Diffusion

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1200(°C) GTF-12/170/728

4" Wafer Bonding

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1200(°C) GTF-12/170/728

Annealing

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1200(°C) GTF-12/170/728

Annealing

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1200(°C) GTF-12/50/546

Wafer N2/Vacuum (10-3)